Tessera has accused Samsung of importing wafer-level packaging semiconductor devices and products that infringe its patents for semiconductor devices with diffusion layers.
Specifically, the patents relate to semiconductor packaging technology, which Tessera claims Samsung has infringed with the power management chips in its Samsung Galaxy and Galaxy Note devices.
The semiconductor company is seeking a limited exclusion order and cease and desist order against Samsung.
Tessera has also filed complaints against Samsung at three federal district courts, as well as other international jurisdictions, including Germany and the Netherlands.
Jon Kirchner, CEO of Tessera, said: “Samsung has benefitted from its use of our semiconductor technologies for 20 years, having entered into its first license with Tessera in 1997.”
He added: “Samsung’s most recent semiconductor patent license expired in December 2016, but we believe it is continuing to use our patented technologies without authorisation, and without paying us fair compensation.”
“We diligently tried to work through our differences with Samsung over an extended period of time, and while we remain in dialogue, unfortunately at this point the parties have not been able to come to an agreement.”
He concluded: “Although we always prefer to reach negotiated license agreements, Samsung has left us with no choice but to defend our intellectual property rights through these legal actions … We are confident in the breadth and quality of the proceedings we initiated today and we strongly believe these actions are in the best interests of the company, our other licensees, and our shareholders.”